Medical: Ventilators, CPAP, anesthesia, infusion pumps, patient monitors, spirometers, BP monitors, thermometers. Automotive: TPMS, MAP/BAP, EV thermal, brake systems. Industrial: Process control, hydraulics, pneumatics, HVAC, filters, PLCs, smart meters. Consumer/Smart Home: Wearables, home appliances, drones, vacuum cleaners. New Energy: Solar inverters, wind turbines, EV charging, energy storage. Smart Agriculture: Irrigation, greenhouse, livestock. IoT: Smart city, environmental monitoring, asset tracking. ...

HBGK's GPS/GBS/GNS system is unique: one MEMS chip supports 3 pressure modes through package configuration. GPS (Gauge Positive): standard positive range (e.g. 0~1bar). GBS (Gauge Bidirectional): bidirectional range (e.g. -0.5~0.5bar). GNS (Gauge Negative): negative range (e.g. -1~0bar). Benefits: 1) One chip qualification for 3 use cases (~60% certification savings); 2) Unified BOM simplifies inventory; 3) Consistent performance across all variants. Available in both Analog and Digital I2C across HBP1101/1201/1301/1302/1311/1312/1801/1901 series. ...

Full customization: pressure range, accuracy (1%FS default), output type (Analog/Digital I2C/4-20mA), package, temperature compensation, anti-corrosion treatment, chip-level modifications. Standard MOQ: 1K pcs. Custom MOQ: 5K-50K depending on complexity. Lead time: evaluation units 3-5 working days, custom development 2-4 weeks, mass production 2-8 weeks. PhD-led R&D team provides comprehensive design-in support from concept to production....

HBGK (Wuxi Haobang High-Tech Co., Ltd.): Wuxi, Jiangsu, China. Two manufacturing bases in Jiangsu & Zhejiang. 400+ intelligent production equipment, 16 fully-automatic SMT lines, Class 100/1000 cleanrooms, 15 smart manufacturing scenarios. 50M+ sensors/month, 100M+ MEMS packaging/month. ISO 9001 certified, automotive AEC-Q100 qualified, medical ISO 13485 aligned. Full ERP/MES/Lot Trace digital management. Worldwide DHL/FedEx/UPS shipping. 20+ years MEMS experience. ...

Gauge: Relative to atmosphere. For TPMS, water level, HVAC, compressors. Most common. Absolute: Built-in vacuum reference. For barometers, altimeters, GPS altitude, weather stations. Unaffected by atmospheric changes. Differential: Measures pressure difference between two ports. For air/gas flow, filter monitoring, respiratory devices (ventilators, CPAP, spirometers). Bidirectional Differential (50xx): Measures both positive and negative differential. For precision medical flow and HVAC. HBGK covers all types at multiple ranges. ...

HBP4xx: Basic MEMS sensors, mV/5V output, medical/HVAC/consumer (87 SKUs). HBP11xx-13xx: Advanced multi-package platform with GPS/GBS/GNS options, one chip supports 3 pressure modes, Analog or I2C, automotive/medical/IoT (200+ SKUs). HBP14xx-15xx: LGA chip-scale and compact packages, ultra-small for TPMS/wearables/drones. HBP18xx-19xx: High-integration DIP6/FR4 modules with digital I2C option and wide voltage, smart home/healthcare/IoT. HBP50xx: Bidirectional differential pressure, precision medical flow & industrial gas metering. All share self-developed MEMS technology. ...

Device-level (87 SKUs, e.g. HBP401G010S6): Bare MEMS sensor chip in standard IC package. You design PCB, signal conditioning, calibration. Lower per-unit cost for high volume (>50K). Module-level (313 SKUs, e.g. HBP1101A010GPS6): Integrated with signal conditioning, some with temperature compensation. Faster time-to-market, lower design effort. Available in Analog and Digital I2C. Both use same in-house MEMS chip. Choose device for cost-optimized high volume with in-house electronics capability; choose module for ease of integration and faster prototyping. ...

Analog (A-type/mV/4-20mA): Continuous voltage or current output. Direct to ADC or PLC input. Lower latency, simpler for experienced engineers. Ideal for industrial PLCs, automotive ECUs, traditional control systems. Digital I2C (D-type): I2C bus output, 1.8-3.6V supply. Built-in ADC+calibration. Lower power for battery devices. Direct MCU read without external ADC. Ideal for IoT, smart home, wearables, battery-powered devices. Both use the same in-house MEMS chip - choose based on your system architecture. ...

HBGK offers 400 unique pressure sensor SKUs: 87 device-level (bare MEMS chips in standard IC packages) and 313 module-level (integrated with signal conditioning and calibration). Coverage: 0.01~25 bar, gauge/absolute/differential, Analog mV/4-20mA and Digital I2C outputs, SOP6/SOP8/DIP4/DIP6/LGA4/LGA8/FR4/SOIC16 packages. Contact our engineering team with your requirements for a tailored recommendation within 24 hours. Complimentary evaluation units available for qualified projects. ...

Three core differentiators: 1) In-house MEMS chip design and fabrication - we are a true IDM (Integrated Device Manufacturer), not a packaging-only house. Full control over chip performance, chip-level customization, and unmatched batch consistency. 2) 20+ years MEMS R&D experience with 50M+ sensor monthly capacity across 16 SMT lines and Class 100/1000 cleanrooms. 3) Full chain from MEMS chip design to wafer fabrication to packaging to testing to module assembly. Most competitors only package. ISO 9001 certified, automotive AEC-Q100 qualified processes, medical ISO 13485 aligned. ...