Device-level (87 SKUs, e.g. HBP401G010S6): Bare MEMS sensor chip in standard IC package. You design PCB, signal conditioning, calibration. Lower per-unit cost for high volume (>50K). Module-level (313 SKUs, e.g. HBP1101A010GPS6): Integrated with signal conditioning, some with temperature compensation. Faster time-to-market, lower design effort. Available in Analog and Digital I2C. Both use same in-house MEMS chip. Choose device for cost-optimized high volume with in-house electronics capability; choose module for ease of integration and faster prototyping.